SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced significant enhancements to its Gauss ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced the availability of the latest version ...

SAN JOSE, Calif., July 20, 2020 /PRNewswire/ -- Avishtech, Inc., a simulation-based design software provider, announced the introduction of its Gauss suite of software for the design and simulation of ...

Polar Instruments Ltd, and Ventec Europe announce that the Materials Library in Polar’s Speedstack PCB stack-up design and documentation system has been extended to include Ventec’s latest PCB ...

Why today’s high-speed, high-frequency designs have very little “wiggle room” within them relative to laminate properties. Why the end-product’s application and performance determine the most critical ...

Building electronics in unconventional form factors with high packaging density is possible thanks to three-dimensional circuit designs using flex and rigid-flex printed circuit boards (PCBs).

Most every device and electronic piece of equipment is outfitted with a printed circuit board (PCB), including smartphones, TVs, appliances, and more. You know the composite. The boards are laminated ...