Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

At the upcoming Fakuma show in Germany, Netstal will present what company officials are calling a world's first: injection-compression molding on stack molds. Fakuma is set for Oct. 13-17 in ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

2008 - PACE Award Winner Webasto AG What: Low Pressure Injection-Compression Process for Panoramic Polycarbonate Roof Module Judge's Citation: OEMs are increasingly eager to substitute polycarbonate ...